The Senior Manager – Mechanical Engineering will lead a team engaged in research and development of cutting-edge satellite communication equipment & systems, engineering mechanical solutions to electronic packaging challenges at the chip level, board level, & enclosure level. Custom indoor and outdoor enclosure design for custom circuit boards is a major area of focus for the team.
REQUIRED EXPERIENCE AND SKILLS:
10+ years of experience designing electronic packaging solutions for printed circuit boards, chips, or related
3+ years of experience leading R&D mechanical engineering teams
Experience managing full product life cycle from concept to production release
Experience performing thermal analysis & structural analysis
Experience with design & analysis, creating process improvements, and auditing project outcomes
Experience managing and developing an engineering team
Project management experience
Experience designing with SolidWorks or related
BS in Mechanical Engineering or related
DESIRED EXPERIENCE AND SKILLS:
Experience with packaging for telecommunications electronic packaging or satellite communication equipment & systems
Experience designing with CREO 3D CAD system
Experience with material design knowledge for high volume fabrication techniques a must (including plastics, die castings, extrusions, sheet metal, & elastomers).
Knowledge with environmental test standards MIL-STD-810 & DO-160
MS in Mechanical Engineering or related
Salary Range: $100,000 to $130,000 DOE – Higher Salary Available with Electronics Packaging for Telecom or Satellite industry experience
Full relocation package is available.
Please contact us for additional details and to discuss position.
**NO SPONSORSHIP IS AVAILABLE FOR THIS POSTION**
Worth Busbee- Senior Technical Recruiter
Schedule a time: Schedule a time to discuss
Job ID: #1906